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Thermal Conductive Eancapsulant
Thermal Conductive Eancapsulant
Mainly used in potting of sensors, transformers, relays, LED drive power supplies and new energy batteries。
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Features and Benefits
Thermal conductivity 0.6~4.0W/mk; Good fluidity, easy for potting; Good anti-settling properties and good deep curing properties; Low linear shrinkage, easy to repair.
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